Water-Cooled Heat Sink Series
Flow path design to achieve uniform cooling
Water is circulated inside a metal plate to cool the entire plate, and a heating element is attached to absorb heat. This is primarily used for cooling semiconductor devices such as IGBTs, as well as for various applications and industries including UV-LEDs, amplifiers, and Peltier elements. The performance of water-cooled heat sinks varies significantly depending on the flow path structure and the machining precision of the element surface. Our company is committed to efficient and uniform cooling within the plane, and we design and manufacture water-cooled heat sinks that meet your desired performance and shape.
- Company：カワソーテクセル
- Price：Other
